Micron’s Full Suite of Automotive-Grade Solutions Qualified for Qualcomm Automotive Platforms to Power AI in Vehicles

April 10, 2024

https://www.globenewswire.com/news-release/2024/04/10/2860473/14450/en/Micron-s-Full-Suite-of-Automotive-Grade-Solutions-Qualified-for-Qualcomm-Automotive-Platforms-to-Power-AI-in-Vehicles.html

NUREMBERG, Germany, April 10, 2024 (GLOBE NEWSWIRE) — Embedded World — Micron Technology, Inc. (Nasdaq:MU), today announced that it has qualified a full suite of its automotive-grade memory and storage solutions for Qualcomm Technologies Inc.’s Snapdragon® Digital Chassis™, a comprehensive set of cloud-connected platforms designed to power data-rich, intelligent automotive services. Micron’s low-power double data rate 5X (LPDDR5X) memory, Universal Flash Storage (UFS) 3.1, Xccela™ flash memory and quad serial peripheral interface NOR (SPI-NOR) flash have been pre-integrated for the latest generation of Snapdragon automotive solutions and modules, including the Snapdragon® Cockpit Platform, Snapdragon Ride™ Platform and Snapdragon Ride™ Flex System-on-Chip (SoC), all of which are intended to handle the increasing requirements of modern and future workloads for artificial intelligence (AI) technologies. This work between Micron and Qualcomm Technologies is aimed at helping the ecosystem build next-generation intelligent vehicles powered by sophisticated AI.

Read more at globenewswire.com

NASDAQ and NYSE quotes and data are delayed 15 minutes unless indicated otherwise. Market data and exchange information are provided for informational purposes only and is not intended for trading purposes. Neither 24/7 Market News Editors, 247 Market News, or data and content providers shall be liable for any errors or omissions, delays, misquotes or other market information relayed in any press materials. You should Use Realtime data to conduct due diligence before investing or trading, and trading in any stock is risky you could lose all your money.