ACM Research Adds Metal Lift Off Capability to Ultra C pr Tool to Support Power Semiconductor Manufacturing and Wafer Level Packaging Applications

November 11, 2022

https://www.globenewswire.com/news-release/2022/11/11/2554195/0/en/ACM-Research-Adds-Metal-Lift-Off-Capability-to-Ultra-C-pr-Tool-to-Support-Power-Semiconductor-Manufacturing-and-Wafer-Level-Packaging-Applications.html

FREMONT, Calif., Nov. 11, 2022 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ:ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced that it has expanded its Ultra C pr product offering to include metal lift-off (MLO) capabilities for power semiconductor manufacturing and wafer level packaging (WLP) applications. MLO can be used to save an etch process step, reducing cost, optimizing cycle times and sharply reducing chemical demand at high temperatures. The company also announced that the first MLO-capable Ultra C pr tool has been qualified and released to mass production at a power semiconductor manufacturer in China.

Read more at globenewswire.com

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