Automate Installation Process with Press-Fit Terminal Power Modules for a Solder-Free Solution in High-Volume Manufacturing

December 15, 2023

https://www.globenewswire.com/news-release/2023/12/06/2791701/0/en/Automate-Installation-Process-with-Press-Fit-Terminal-Power-Modules-for-a-Solder-Free-Solution-in-High-Volume-Manufacturing.html

CHANDLER, Ariz., Dec. 06, 2023 (GLOBE NEWSWIRE) — The E-Mobility, sustainability and data center markets require products that are conducive to high-volume manufacturing. To better automate the installation process, Press-Fit terminals are often used because they offer a solder-free solution to mount power modules to the PCB. Microchip Technology (Nasdaq:MCHP) today announces its expansive portfolio of SP1F and SP3F power modules are now available with Press-Fit terminals for high-volume applications.

Read more at globenewswire.com

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