Breakthrough Digital Lithography Technology From Applied Materials and Ushio to Enable More Powerful Computing Systems for the AI Era
SANTA CLARA, Calif. and TOKYO, Dec. 12, 2023 (GLOBE NEWSWIRE) — Applied Materials, Inc. and Ushio, Inc. today announced a strategic partnership to accelerate the industry’s roadmap for heterogeneous integration (HI) of chiplets into 3D packages. The companies are jointly bringing to market the first digital lithography system specifically designed for patterning the advanced substrates needed in the Artificial Intelligence (AI) era of computing.
Related news for (AMAT)
- Charging Into After-Hours: Small-Caps Close Strong as XPON, VENU, and LIXT Light Up the Board
- Applied Materials Announces Second Quarter 2025 Results
- Applied Materials Increases Quarterly Cash Dividend by 15 Percent and Announces New $10 Billion Share Repurchase Authorization
- Applied Materials Announces First Quarter 2025 Results
- Applied Materials Announces Cash Dividend