SAN JOSE, Calif., June 12, 2024 (GLOBE NEWSWIRE) — Today, Adeia Inc. (Nasdaq:ADEA), a leading R&D and intellectual property (IP) licensing company known for bringing leading innovations in the semiconductor and media/entertainment technology sectors to market, announced recent developments in hybrid bonding a technology targeted toward the future of semiconductor packaging enabling high-performance computing capabilities, like those required for AI.
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