Micron Delivers the World’s Most Compact UFS Package to Enable Next-Generation Phone Designs and Larger Batteries

February 27, 2024

https://www.globenewswire.com/news-release/2024/02/27/2835651/14450/en/Micron-Delivers-the-World-s-Most-Compact-UFS-Package-to-Enable-Next-Generation-Phone-Designs-and-Larger-Batteries.html

BARCELONA, Spain, Feb. 27, 2024 (GLOBE NEWSWIRE) — Mobile World Congress — Micron Technology, Inc. (Nasdaq:MU) announced today that it is delivering qualification samples of an enhanced version of its Universal Flash Storage (UFS) 4.0 mobile solution with breakthrough proprietary firmware features delivered in the world’s most compact UFS package at 9×13 millimeters (mm). Built on its advanced 232-layer 3D NAND and offering up to 1 terabyte (TB) capacity, the UFS 4.0 solution provides best-in-class performance and end-to-end innovation, enabling faster and more responsive experiences on flagship smartphones.

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