Adeia Demonstrates Hybrid Bonding Technology During Chiplet Summit 2024

February 6, 2024

https://www.globenewswire.com/news-release/2024/02/06/2824328/0/en/Adeia-Demonstrates-Hybrid-Bonding-Technology-During-Chiplet-Summit-2024.html

SANTA CLARA, Calif., Feb. 06, 2024 (GLOBE NEWSWIRE) — Adeia Inc. (Nasdaq:ADEA), the company whose patented innovations enhance billions of devices, today announced that it is showcasing its hybrid bonding technology at the Chiplet Summit on February 6 through 8, 2024, at the Santa Clara Convention Center.

Read more at globenewswire.com

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